Exclusive: China readying $143 billion package for its chip firms in the face of US curbs

HONG KONG, Dec 13 (Reuters) – China is working on a more than 1 trillion yuan ($143 billion) support package for its semiconductor industry, three sources said, in a major step towards self-sufficiency in chips and to counter US moves aimed at slowing its technological advances. Beijing plans to roll out what will be one …

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